STPS20M100ST datasheet(4/11 Pages) STMICROELECTRONICS

4 / 11 page

Characteristics

STPS20M100S

4/11

Doc ID 15521 Rev 2

Figure 8.

Relative variation of thermal

impedance junction to case

versus pulse duration

Figure 9.

Relative variation of thermal

impedance junction to case versus

pulse duration

Zth(j-c)/Rth(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-03

1.E-02

1.E-01

1.E+00

Single pulse

TO-220AB/I²PAK/D ²PAK

tp(s)

Zth(j-c)/Rth(j-c)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

TO-220FPAB

tp(s)

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under tab

Figure 11.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 12.

Junction capacitance versus

reverse voltage applied

(typical values)

Figure 13.

Forward voltage drop versus

forward current (terminals 1 and 3

short circuited)

th(j-a)(°C/W)

D²PAK

SCu(cm²)

Epoxy printed board FR4, copper thickness = 35 µm)

IR(mA)

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1020

3040506070

8090

100

Tj=150°C

Tj=125°C

Tj=25°C

Tj=100°C

Tj=75°C

Tj=50°C

VR(V)

C(pF)

100

1000

10000

100

F=1MHz

VOSC=30mVRMS

Tj=25°C

VR(V)

IFM(A)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

(V)

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