Specifications are subject to change without notice.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Typical Time to Trip at 23 ˚C

100

1

10

0.1

0.01

0.001

0.1

1

10

100

Fault Current (Amps)

MF-SM SERIES, REV. Q, 11/04

Solder Reflow Recommendations

160–220

300

250

200

150

100

50

0

10–20

120

Preheating

Soldering

Cooling

Time (seconds)

Solder reflow

• Recommended reflow methods: IR, vapor phase oven, hot air oven.

• Devices are not designed to be wave soldered to the bottom side of the

board.

• Gluing the devices is not recommended.

• Recommended maximum paste thickness is 0.25 mm (.010 inch).

• Devices can be cleaned using standard industry methods and solvents.

Note:

• If reflow temperatures exceed the recommended profile, devices may not

meet the performance requirements.

Rework

• A device should not be reworked.

Typical Part Marking

Represents total content. Layout may vary.

MANUFACTURER'S

TRADEMARK

PART

IDENTIFICATION

030

0A

DATE CODE -

WEEK 1 OF 2000 = 0A

(YEAR & WEEK)

WEEK 27 OF 2000 = A0

(WEEK & YEAR)