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MP24971DN Folha de dados(PDF) 2 Page - Monolithic Power Systems |
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MP24971DN Folha de dados(HTML) 2 Page - Monolithic Power Systems |
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2 / 14 page ![]() MP24971 –1.5A, 50V, 100kHz, 5V FIXED OUTPUT STEP-DOWN CONVERTER MP24971 Rev. 1.01 www.MonolithicPower.com 2 1/6/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2012 MPS. All Rights Reserved. ORDERING INFORMATION Part Number Package Top Marking Operating Temperature (TJ) MP24971DS* SOIC8 MP24971 -40 C to +125C MP24971DN** SOIC8E MP24971 -40 C to +125C * For Tape & Reel, add suffix –Z (eg. MP24971DS–Z); For RoHS, compliant packaging, add suffix –LF (eg. MP24971DS–LF–Z). ** For Tape & Reel, add suffix –Z (eg. MP24971DN–Z); For RoHS, compliant packaging, add suffix –LF (eg. MP24971DN–LF–Z). PACKAGE REFERENCE SOIC8 SOIC8E ABSOLUTE MAXIMUM RATINGS (1) Input Voltage VIN .......................................... 60V VISN, VISP, VVOS........................................0V to 8V |VISN -VISP| ...........................................0V to 0.4V VSW..................................... -0.3V to (VIN + 0.3V) VBST ................................................... VSW + 6.5V All Other Pins...............................-0.3V to +6.5V Junction Temperature...............................150°C Lead Temperature ....................................260°C Storage Temperature............... -65°C to +150°C Continuous Power Dissipation (TA = 25°C) (2) SOIC8 ...................................................... 1.38W SOIC8E...................................................... 2.5W ESD Susceptibility HBM (Human Body Mode).......................... 2kV Recommended Operating Conditions (3) Input Voltage VIN................................. 8V to 50V Maximum Junction Temp. (TJ) ................ 125°C Thermal Resistance (4) θJA θJC SOIC8..................................... 90 ...... 45... °C/W SOIC8E .................................. 50 ...... 10... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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