DOCUMENT

: SR3F0000NH

REVISION

: A0

PAGE

: 5 OF 8

SPECIFICATION FOR APPROVAL

Mounting Method

(1) Mounting method according to solder bath method

Epoxy based adhesive agent shall be applied in the middle of two lands of the test board.

The specimen shall be mounted in such a way that the electrode of specimen will be evenly

placed in the land area and then adhesive agent shall be cured.

After applying the Resin Flux with 25 weight % Methyl Alcohol, the board shall be soldered by

dipping into a molten solder bath with 260

± 5℃ for 3 to 5 seconds

(2) Mounting method according to refolw soldering method

Solder paste with approximate 200

μm thickness shall be applied to the land of test board.

The specimen shall be mounted in such way that the electrodes of specimen will be evenly placed

in the land area and then shall be soldered under the circumstance that the surface temperature of

the board shall be raised 240

± 5℃(peak temperature) for 5 to 10 seconds in an upper-heater

oven.

Test Board

Material : Glass Fabric Epoxy Resin (Refer to JIS C 6484)

Board thickness : 1.6mm

Copper foil thickness : 0.035mm

(1) Test board A (For substrate bending test)

Unit : mm

100

a

f

b

4.5

Land

Solder resist

a

b

c

f

1.2

4.0

1.65

(3.0)