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ADL5321ARKZ-R7 Folha de dados(PDF) 11 Page - Analog Devices |
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ADL5321ARKZ-R7 Folha de dados(HTML) 11 Page - Analog Devices |
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11 / 16 page ![]() Data Sheet ADL5321 Rev. C | Page 11 of 16 BASIC LAYOUT CONNECTIONS The basic connections for operating the ADL5321 are shown in Figure 28. Table 6 lists the required matching components. Capacitors C1, C2, C3, C4, and C7 are Murata GRM155 series (0402 size) and Inductor L1 is a Coilcraft 0603CS series (0603 size). For all frequency bands, the placement of C3 and C7 is critical. From 2500 MHz to 2700 MHz, the placement of C1 is also important. Table 7 lists the recommended component placement for various frequencies. A 5 V dc bias is supplied through L1 that is connected to RFOUT (Pin 3). In addition to C4, 10 nF and 10 μF power supply decoupling capacitors are also required. The typical current consumption for the ADL5321 is 90 mA. Figure 28. Basic Connections SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN Figure 29 shows the recommended land pattern for the ADL5321. To minimize thermal impedance, the exposed paddle on the SOT-89 package underside is soldered down to a ground plane along with (GND) Pin 2. If multiple ground layers exist, they should be stitched together using vias. For more information on land pattern design and layout, refer to the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). This land pattern, on the ADL5321 evaluation board, provides a measured thermal resistance (θJA) of 35°C/W. To measure θJA, the temperature at the top of the SOT-89 package is found with an IR temperature gun. Thermal simulation suggests a junction temperature 10°C higher than the top of package temperature. With additional ambient temperature and I/O power measure- ments, θJA could be determined. Figure 29. Recommended Land Pattern Table 6. Recommended Components for Basic Connections Frequency (MHz) C1 (pF) C2 (pF) C3 (pF) C4 (pF) C7 (pF) L1 (nH) 2500 to 2700 1.0 10 1.2 10 Open 9.5 3400 to 3850 10 10 1.2 10 1.0 9.5 Table 7. Matching Component Spacing Frequency (MHz) λ1 (mils) λ2 (mils) λ3 (mils) λ4 (mils) 2500 to 2700 240 75 89 325 3400 to 3850 90 35 40 416 1 2 (2) 3 ADL5321 C6 10µF C5 10nF C41 L11 VCC GND RFIN C21 C31 RFOUT C11 C71 λ12 λ32 λ42 λ22 1SEE TABLE 5 FOR FREQUENCY SPECIFIC COMPONENTS. 2SEE TABLE 6 FOR RECOMMENDED COMPONENT SPACING. 0.86mm 5.56mm 0.20mm 1.80mm 1.27mm 0.62mm 3.48mm 1.50mm 3.00mm |
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