OPA445AP datasheet(13/25 Pages) TI

13 / 25 page

OPA445

SBOS156B − MARCH 1987 − REVISED APRIL 2008

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With these preparatory steps in place, the PowerPAD

IC is simply placed in position and run through the

solder reflow operation as any standard surfacemount

component. This preparation results in a properly

installed part.

For detailed information on the PowerPAD package,

including thermal modeling considerations and repair

procedures, see technical brief SLMA002 PowerPAD

Thermally-Enhanced Package available for download at

www.ti.com.

OPTIONAL:

REQUIRED:

Thermal Land

(Copper)

Minimum S ize

4.8mm x 3.8mm

(189 mils x 150 mils)

Additional four vias outside

of thermal pad area but

under the package.

Thermal pad area 2.286mm x 2.286mm

(90 mils x 90 mils) with five vias

(via diameter = 13 mils)

Figure 14. 8-Pin PowerPAD PCB Etch and Via

Pattern

TYPICAL APPLICATIONS

OPA445

Compliance Voltage Range =

±35V

NOTE: R

1 =R3 and R2 =R4 +R5

+40V

100k

Ω

10k

Ω

100k

Ω

9.9k

Ω

−40V

100

Ω

Load

L =[(V2 − V1)/R5](R2/R1)

=(V

2 − V1)/1kΩ

Figure 15. Voltage-to-Current Converter

OPA445

0−2mA

+60V

25k

Ω

−12V

O = 0V to +50V

at 10mA

0.1

µF

0.1

µF

Protects DAC

During Slewing

DAC8811

DAC7811

Figure 16. Programmable Voltage Source

+45V

160V

Piezo(1)

Crystal

−45V

Master

Ω

±4V

OPA445

+45V

−45V

Slave

10k

Ω

10k

Ω

OPA445

NOTE: (1) For transducers with large capacitance the stabilization

technique described in Figure 6 may be necessary. Be certain that the

Master amplifier is stable before stabilizing the Slave amplifier.

Figure 17. Bridge Circuit Doubles Voltage for Piezo Crystals

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