LP2995LQ datasheet(3/22 Pages) TI

3 / 22 page

LP2995

www.ti.com

SNVS190M – FEBRUARY 2002 – REVISED MARCH 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

AVIN to GND

−0.3V to +6V

PVIN to GND

-0.3V to AVIN

VDDQ (3)

−0.3V to +6V

Storage Temp. Range

−65°C to +150°C

Junction Temperature

150°C

SO PowerPAD-8 Thermal Resistance (

θJA)

43°C/W

SOIC-8 Thermal Resistance (

θJA)

151°C/W

WQFN-16 Thermal Resistance (

θJA)

51°C/W

Lead Temperature (Soldering, 10 sec)

260°C

ESD Rating (4)

1kV

(1)

Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating range indicates conditions for which

the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test conditions

see Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

VDDQ voltage must be less than 2 x (AVIN - 1) or 6V, whichever is smaller.

(4)

The human body model is a 100pF capacitor discharged through a 1.5k

Ω resistor into each pin.

Operating Range

Junction Temp. Range (1)

0°C to +125°C

AVIN to GND

2.2V to 5.5V

PVIN to GND

2.2V to AVIN

(1)

At elevated temperatures, devices must be derated based on thermal resistance. The device in the SOIC-8 package must be derated at

θJA = 151° C/W junction to ambient with no heat sink. The device in the WQFN-16 must be derated at θJA = 51° C/W junction to

ambient.

Electrical Characteristics

Specifications with standard typeface are for TJ = 25°C and limits in boldface type apply over the full Operating

Temperature Range (TJ = 0°C to +125°C). Unless otherwise specified, AVIN = PVIN = 2.5V, VDDQ = 2.5V

(1).

Symbol

Parameter

Conditions

Min

Typ

Max

Units

VREF

VREF Voltage

IREF_OUT = 0mA

1.21

1.235

1.26

VOSVTT

VTT Output Voltage Offset

IOUT = 0A

−15

(2)

−20

ΔVTT/VTT

Load Regulation

IOUT = 0 to 1.5A

0.5

(3)

IOUT = 0 to −1.5A

−0.5

ZVREF

VREF Output Impedance

IREF = −5µA to +5µA

Ω

ZVDDQ

VDDQ Input Impedance

100

Ω

Quiescent Current

IOUT = 0A

250

400

µA

(4)

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using

Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).

(2)

VTT offset is the voltage measurement defined as VTT subtracted from VREF.

(3)

Load regulation is tested by using a 10ms current pulse and measuring VTT.

(4)

Quiescent current defined as the current flow into AVIN.

Submit Documentation Feedback

Product Folder Links: LP2995

LP2995LQ Folha de dados(PDF) 3 Page - Texas Instruments

LP2995LQ Folha de dados(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

Folha de dados Download

Ligação URL