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ADP5585ACBZ-01-R7 Folha de dados(PDF) 37 Page - Analog Devices |
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ADP5585ACBZ-01-R7 Folha de dados(HTML) 37 Page - Analog Devices |
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37 / 40 page ![]() Data Sheet ADP5585 Rev. C | Page 37 of 40 OUTLINE DIMENSIONS A B C D 0.545 0.500 0.455 SIDE VIEW 0.230 0.200 0.170 0.300 0.260 0.220 COPLANARITY 0.05 SEATING PLANE 1 2 3 4 BOTTOM VIEW (BALL SIDE UP) TOP VIEW (BALL SIDE DOWN) BALL A1 IDENTIFIER 0.40 REF 1.20 REF 1.630 1.590 SQ 1.550 Figure 28. 16-Ball Wafer Level Chip Scale Package [WLCSP] (CB-16-10) Dimensions shown in millimeters 3.10 3.00 SQ 2.90 0.30 0.23 0.18 1.75 1.60 SQ 1.45 1 0.50 BSC BOTTOM VIEW TOP VIEW 16 5 8 9 12 13 4 EXPOSED PAD PIN 1 INDICATOR 0.50 0.40 0.30 SEATING PLANE 0.05 MAX 0.02 NOM 0.20 REF 0.25 MIN COPLANARITY 0.08 PIN 1 INDICATOR FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. 0.80 0.75 0.70 COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6. Figure 29. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ] 3 x 3 mm Body, Very Very Thin Quad (CP-16-22) Dimensions shown in millimeters |
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