MPC8349EVVALDB datasheet(54/87 Pages) FREESCALE

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MPC8349EVVALDB Folha de dados(PDF) 54 Page - Freescale Semiconductor, Inc

Nome de Peças	MPC8349EVVALDB

Descrição Electrónicos	Integrated Host Processor Hardware Specifications

PDF	87 Pages

Scroll/Zoom	100%

Fabricante Electrônico	FREESCALE [Freescale Semiconductor, Inc]

Página de início	http://www.freescale.com

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13

Freescale Semiconductor

Package and Pin Listings

18.1

Package Parameters for the MPC8349EA TBGA

The package parameters are provided in the following list. The package type is 35 mm

× 35 mm, 672 tape

ball grid array (TBGA).

Package outline

35 mm

× 35 mm

Interconnects

672

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder balls

62 Sn/36 Pb/2 Ag (ZU package)

96.5 Sn/3.5Ag (VV package)

Ball diameter (typical)

0.64 mm

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