HCPL-6531 datasheet(2/13 Pages) AVAGO

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Functional Diagram

Multiple Channel Devices Available

Truth Table

(Positive Logic)

Input

Output

On (H)

Off (L)

V CC

GND

V O

V B

Each channel contains a GaAsP light emitting diode which

is optically coupled to an integrated photon detector.

Separate connections for the photodiodes and output

transistor collectors improve the speed up to a hundred

times that of a conventional phototransistor optocoupler

by reducing the base-collector capacitance.

These devices are suitable for wide bandwidth analog

applications, as well as for interfacing TTL to LSTTL or

CMOS. Current Transfer Ratio (CTR) is 9% minimum at IF

= 16 mA. The 18 V VCC capability will enable the designer

to interface any TTL family to CMOS. The availability of

the base lead allows optimized gain/ bandwidth adjust-

ment in analog applications. The shallow depth of the

IC photodiode provides better radiation immunity than

conventional phototransistor couplers.

These products are also available with the transistor base

node not connected to improve common mode noise

immunity and ESD susceptibility. In addition, higher CTR

minimums are available by special request.

Package styles for these parts are 8 and 16 pin DIP through

hole (case outlines P and E respectively), 16 pin DIP flat

pack (case outline F), and leadless ceramic chip carrier

(case outline 2). Devices may be purchased with a variety

of lead bend and plating options, see Selection GuideTable

for details. Standard Microcircuit Drawing (SMD) parts are

available for each package and lead style.

Because the same functional die (emitters and detectors)

are used for each channel of each device listed in this

data sheet, absolute maximum ratings, recommended

operating conditions, electrical specifications, and perfor-

mance characteristics shown in the figures are identical

for all parts. Occasional exceptions exist due to package

variations and limitations and are as noted. Additionally,

the same package assembly processes and materials are

used in all devices. These similarities give justification for

the use of data obtained from one part to represent other

part’s performance for die related reliability and certain

limited radiation test results.

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