EP2C50 datasheet(21/182 Pages) ALTERA

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Package Information Datasheet for Mature Altera Devices

Device and Package Cross Reference

Altera Corporation

Package Information Datasheet for Mature Altera Devices

Excalibur Devices

Table 22 lists the device name, package type, and number of pins for the Excalibur

device family.

1 The package type entries with “Option #” refer to instances where multiple package

options exist for a given package type and pin count. The option number identifies the

specific type used by the corresponding device density.

EPF6016

TQFP, Wire Bond

144

PQFP, Wire Bond

208

PQFP, Wire Bond

240

BGA, Wire Bond, Option 2

256

EPF6016A

TQFP, Wire Bond

100

FBGA, Wire Bond

100

TQFP, Wire Bond

144

PQFP, Wire Bond

208

FBGA, Wire Bond, Option 1

256

EPF6024A

TQFP, Wire Bond

144

PQFP, Wire Bond

208

PQFP, Wire Bond

240

BGA, Wire Bond, Option 2

256

FBGA, Wire Bond, Option 1

256

EPF8282A

PLCC, Wire Bond

TQFP, Wire Bond

100

EPF8452A

TQFP, Wire Bond

100

PQFP, Wire Bond

160

Table 21. FLEX 10KE Devices (Part 3 of 3)

Device

Package

Pins

Table 22. Excalibur Devices

Device

Package

Pins

EPXA1

FBGA, Wire Bond, Option 2

484

Dual-Piece Lid: FBGA, Flip Chip, Option 1

672

EPXA4

Dual-Piece Lid: FBGA, Flip Chip, Option 1

672

Dual-Piece Lid: FBGA, Flip Chip, Option 1

1020

EPXA10

Dual-Piece Lid: FBGA, Flip Chip, Option 1

1020

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