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SIP32452 Folha de dados(PDF) 11 Page - Vishay Telefunken |
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SIP32452 Folha de dados(HTML) 11 Page - Vishay Telefunken |
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11 / 13 page ![]() Package Information www.vishay.com Vishay Siliconix Revision: 10-Oct-11 1 Document Number: 63459 THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 WCSP4: 4 Bumps (2 x 2 , 0.4 mm pitch, 208 μm bump height, 0.8 mm x 0.8 mm die size) Notes (1) Laser mark on the backside surface of die (2) Bumps are SAC396 (3) 0.050 max. coplanarity Note a. Use millimeters as the primary measurement. MILLIMETERSa INCHES DIM. MIN. NOM. MAX. MIN. NOM. MAX. A 0.515 0.530 0.545 0.0202 0.0208 0.0214 A1 0.208 0.0081 b 0.250 0.260 0.270 0.0098 0.0102 0.0106 e 0.400 0.0157 D 0.720 0.760 0.800 0.0182 0.0193 0.0203 4 x Ø b Bump Note 2 A B Pin 1 mark W B A 12 1 2 A B Mark on backside of die e D ECN: T11-0497-Rev. B, 10-Oct-11 DWG: 6004 |
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