GND

SCL

SDA

V+

A0

ALERT

A1

B1

C1

A2

B2

C2

TMP108

SBOS663 – APRIL 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

TMP108

UNIT

Supply voltage

3.6

V

–0.5 to 3.6

V

Input voltage for A0 and ALERT

–0.5 to (V+) + 0.3

V

Operating temperature

–55 to +150

°C

Storage temperature

–60 to +150

°C

Junction temperature

+150

°C

Electrostatic

Human body model (HBM)

2000

V

discharge (ESD)

Charged device model (CDM)

1000

V

ratings

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

If A0 is connected to SCL or SDA, the input voltage rating for A0 applies to SCL or SDA.

PIN CONFIGURATION

YFF PACKAGE

DSBGA-6

(TOP VIEW)

PIN DESCRIPTIONS

PIN

PIN

DESCRIPTION

NAME

NUMBER

A0

B1

Address selection pin

ALERT

C1

Alert output pin

GND

A2

Ground

SCL

B2

Input clock pin

SDA

C2

Input/output data pin

V+

A1

Supply Voltage (1.4 V to 3.6 V)

2

Submit Documentation Feedback

Copyright © 2013, Texas Instruments Incorporated

Product Folder Links: TMP108