| Os motores de busca de Datasheet de Componentes eletrônicos |
|
RC2012J000CS Folha de dados(PDF) 13 Page - Samsung semiconductor |
|
|
|||||||||||||||||||||||||||||
RC2012J000CS Folha de dados(HTML) 13 Page - Samsung semiconductor |
|
13 / 19 page ![]() ● TAPING METHOD There are empty holes at both start part and end part of carrier tape. <Fig 5> <Fig 5> Reel Packed Part Empty Part Lead Part Adhesion Tape *** ** **** Empty Portion Chips Empty Portion Lead Part 10 Pitches or more 5,000 Pitches or 20,000 Pitches 10 Pitches or more 200~250 mm Note ① The resistor should move in the pocket freely. ② The resistor should not adhere to the top or bottom tape. ③ There should be no vacant pocket. ④ Peeling strength of the top tape should be within 5gf and 80gf. <Fig 6> <Fig 6> 0~10° Top Tape Chip Resistor Carrier Tape Bottom Tape F Peeling |
|
|
Ligação URL |
| ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | Link para a ficha técnica | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |