74HC_HCT259

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 5 — 7 August 2012

14 of 22

NXP Semiconductors

74HC259; 74HCT259

8-bit addressable latch

12. Package outline

Fig 13. Package outline SOT38-4 (DIP16)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT38-4

95-01-14

03-02-13

c

(e )

1

A

L

e

D

Z

16

1

9

8

E

pin 1 index

b

0

5

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

UNIT

A

max.

12

(1)

(1)

(1)

cD

E

e

M

Z

H

L

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

min.

A

max.

b

max.

w

1.73

1.30

0.53

0.38

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

0.254

2.54

7.62

8.25

7.80

10.0

8.3

0.76

4.2

0.51

3.2

inches

0.068

0.051

0.021

0.015

0.014

0.009

1.25

0.85

0.049

0.033

0.77

0.73

0.26

0.24

0.14

0.12

0.01

0.1

0.3

0.32

0.31

0.39

0.33

0.03

0.17

0.02

0.13

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4