| Os motores de busca de Datasheet de Componentes eletrônicos |
|
L6228 Folha de dados(PDF) 22 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
L6228 Folha de dados(HTML) 22 Page - STMicroelectronics |
|
22 / 26 page ![]() L6228 22/26 Figure 28. PowerSO36 Junction-Ambient Thermal Resistance versus On-Board Copper Area. Figure 29. PowerDIP24 Junction-Ambient Thermal Resistance versus On-Board Copper Area. Figure 30. SO24 Junction-Ambient Thermal Resistance versus On-Board Copper Area. Figure 31. Mounting the PowerSO Package. 13 18 23 28 33 38 43 12 3 4 56 7 8 9 10 1 1 1 2 13 W ithout G round La yer W ith Gr ound La yer W ith Gr ound La yer + 16 via Ho le s sq . c m ºC / W On-Board Copper Area 39 40 41 42 43 44 45 46 47 48 49 1 2 3 4 5 6 7 8 9 101112 C opper Are a is on Bo ttom Sid e C opper Are a is on To p S i de sq . cm ºC / W On-Board Copper Area 48 50 52 54 56 58 60 62 64 66 68 123 45 6789 10 11 12 C o pp er A rea is o n T op S ide sq. cm ºC / W On-Board Copper Area Slug soldered to PCB with dissipating area Slug soldered to PCB with dissipating area plus ground layer Slug soldered to PCB with dissipating area plus ground layer contacted through via holes |
|
Ligação URL |
| ALLDATASHEET é útil para você? [ DONATE ] |
Sobre Alldatasheet | Publicidade | Contato conosco | Privacy Policy | Link para a ficha técnica | roca de Link | Lista de Fabricantes All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |