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Vishay BCcomponents

Revision: 23-Apr-13

4

Document Number: 28395

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and/or adjacent components. For recommended

soldering pad dimensions, refer to Fig. 3 and Table 3.



SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

component during processing.

For maximum conditions refer to Fig. 4 or Fig. 5.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

As a general principle, temperature and duration shall be the

minimum necessary required to ensure good soldering

connections. However, the specified maximum curves

should never be exceeded.

Fig. 3 - Recommended soldering pad dimensions

Table 3

RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters

CASE CODE

a

b

c

d

e

f

0810

4.4

2.5

3.0

-

-

-

1010

4.4

2.5

4.0

-

-

-

1012

4.4

2.5

4.0

-

-

-

1014

4.4

2.5

4.0

-

-

-

1213

6.3

2.5

4.0

4.2

5.0

5.6

1216

6.3

2.5

4.0

4.2

5.0

5.6

1616

7.8

9.6

4.7

-

-

-

1621

7.8

9.6

4.7

-

-

-

1816

8.8

9.6

4.7

-

-

-

1821

8.8

9.6

4.7

-

-

-

aa

c

b

aa

c

b

e

d

f

d

Case size Ø D = 12.5 mm

Case size Ø D

≥ 16 mm

Case size Ø D

≤ 10 mm

a

a

b

c