LM317SSLASHNOPB datasheet(4/38 Pages) TI1

4 / 38 page

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

Power Dissipation

Internally Limited

Input-Output Voltage Differential

+40V,

−0.3V

Storage Temperature

−65°C to +150°C

Lead Temperature

Metal Package (Soldering, 10 seconds)

300°C

Plastic Package (Soldering, 4 seconds)

260°C

ESD Tolerance (3)

3 kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test

conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

Human body model, 100 pF discharged through a 1.5 k

Ω resistor.

Operating Temperature Range

LM117

−55°C ≤ TJ ≤ +150°C

LM317A

−40°C ≤ TJ ≤ +125°C

LM317-N

0°C

≤ TJ ≤ +125°C

Preconditioning

Thermal Limit Burn-In

All Devices 100%

LM117 Electrical Characteristics

(1)

Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating

Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.

LM117 (2)

Parameter

Conditions

Min

Typ

Max

Units

≤ (VIN − VOUT) ≤ 40V,

Reference Voltage

1.20

1.25

1.30

10 mA

≤ IOUT ≤ IMAX

(1)

0.01

0.02

Line Regulation

≤ (VIN − VOUT) ≤ 40V

(3)

%/V

0.02

0.05

0.1

0.3

Load Regulation

10 mA

≤ IOUT ≤ IMAX

(1) (3)

0.3

Thermal Regulation

20 ms Pulse

0.03

0.07

%/W

Adjustment Pin Current

100

μA

10 mA

≤ IOUT ≤ IMAX

(1)

Adjustment Pin Current Change

0.2

μA

≤ (VIN − VOUT) ≤ 40V

Temperature Stability

TMIN ≤ TJ ≤ TMAX

Minimum Load Current

(VIN − VOUT) = 40V

3.5

NDS Package

1.5

2.2

3.4

(VIN − VOUT) ≤ 15V

NDT, NAJ Package

0.5

0.8

1.8

Current Limit

NDS Package

0.3

0.4

(VIN − VOUT) = 40V

NDT, NAJ Package

0.15

0.20

RMS Output Noise, % of VOUT

10 Hz

≤ f ≤ 10 kHz

0.003

(1)

IMAX = 1.5A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0A for the DCY (SOT-223) package. IMAX = 0.5A

for the NDT (TO), MDT (PFM), and NAJ (LCCC) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device

maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any

temperature is : PD(MAX) = ((TJ(MAX) - TA)/θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).

(2)

Refer to RETS117H drawing for the LM117H, or the RETS117K for the LM117K military specifications.

(3)

Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to

heating effects are covered under the specifications for thermal regulation.

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