Pressure sensors

Barometric pressure transmitters for SMT

ASB series

Preliminary data

AS SEN PD

2011-05-02

Please read Cautions and warnings and

Page 13 of 16

Important notes at the end of this document

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10. Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Sn-Pb eutectic assembly

Pb-free assembly

Preheat and soak

- Temperature min

- Temperature max

- Time

100 °C

150 °C

60 … 120 s

150 °C

200 °C

60 … 180 s

Average ramp-up rate

3 °C/s max.

3 °C/s max.

Liquidous temperature

Time at liquidous

183 °C

60 … 150 s

217 °C

60 … 150 s

Peak package body temperature

A)

220 °C … 235 °C

B)

245 °C … 260 °C

B)

20 s

C)

30 s

C)

Average ramp-down rate

6 °C/s max.

6 °C/s max.

Time 25 °C to peak temperature

maximum 6 min

maximum 8 min

B) Depending on package thickness. For details please refer to JEDEC J-STD-020D.