AD9732SLASHPCB datasheet(3/11 Pages) AD

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–3–

REV. A

AD9732

Test

AD9732BRS

Parameter

Temp

Level

Min

Typ

Max

Units

SFDR PERFORMANCE (Wideband)

2 MHz AOUT

+25

°CV

10 MHz AOUT

+25

°CV

20 MHz AOUT

+25

°CV

40 MHz AOUT

+25

°CV

2 MHz AOUT (Clock = 165 MHz)

+25

°CV

10 MHz AOUT (Clock = 165 MHz)

+25

°CV

20 MHz AOUT (Clock = 165 MHz)

+25

°CV

40 MHz AOUT (Clock = 165 MHz)

+25

°CV

65 MHz AOUT (Clock = 165 MHz)

+25

°CV

65 MHz AOUT (Clock = 200 MHz)

+25

°CV

80 MHz AOUT (Clock = 200 MHz)

+25

°CV

SFDR PERFORMANCE (Narrowband)15

2 MHz; 2 MHz Span

+25

°CV

25 MHz; 2 MHz Span

+25

°CV

10 MHz; 5 MHz Span (Clock = 200 MHz)

+25

°CV

INTERMODULATION DISTORTION16

F1 = 800 kHz, F2 = 900 kHz to Nyquist

+25

°CV

F1 = 800 kHz, F2 = 900 kHz, Narrowband

(2 MHz)

+25

°CV

NOTES

1Measured as an error in ratio of full-scale current to current through R

SET (640 µA nominal); ratio is nominally 32. DAC load is virtual ground.

2Internal reference voltage is tested under load conditions specified in Internal Reference Output Current specification.

3Internal reference output current defines load conditions applied during Internal Reference Voltage test.

4Full-scale current variations among devices are higher when driving REFERENCE IN directly.

5Frequency at which a 3 dB change in output of DAC is observed; R

L = 50 Ω; 100 mV modulation at midscale.

6Based on I

FS = 32 ([CONTROL AMP IN – (+VS)]/RSET) when using internal control amplifier. DAC load is virtual ground.

7Measured as voltage settling at midscale transition to 0.1%; R

L = 50 Ω.

8Measured from 50% point of rising edge of CLOCK signal to 1/2 LSB change in output signal.

9Peak glitch impulse is measured as the largest area under a single positive or negative transient.

10Measured with R

L = 50 Ω and DAC operating in latched mode.

11Data must remain stable for a specified time prior to rising edge of CLOCK.

12Data must remain stable for a specified time after rising edge of CLOCK.

13Supply voltages should remain stable with

±5% for nominal operation.

14Power dissipation calculation includes current through a 50

Ω load.

15SFDR is defined as the difference in signal energy between the full-scale fundamental signal and worst case spurious frequencies in the output spectrum window.

The frequency span dc to Nyquist unless otherwise noted.

16Intermodulation distortion is the measure of the sum and difference products produced when a two-tone input is driven into the DAC. The distortion products

created will manifest themselves at sum and difference frequencies of the two tones.

Specifications subject to change without notice.

EXPLANATION OF TEST LEVELS

Test Level

100% production tested.

II 100% production tested at +25

°C and sample tested at

specified temperatures.

III Sample tested only.

IV Parameter is guaranteed by design and characterization

testing.

Parameter is a typical value only.

VI 100% production tested at +25

°C; guaranteed by design

and characterization testing for industrial temperature

range.

ORDERING GUIDE

Temperature

Package

Model

Range

Description

Option

AD9732BRS

–40

°C to +85°C

28-Lead Small Outline (SSOP)

RS-28

AD9732/PCB

+25

°C

Evaluation Board

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