CSTCE12M0G55-R0 datasheet(9/26 Pages) MICROCHIP

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MCP2210 BREAKOUT MODULE

USER’S GUIDE

DS52056A-page 9

Chapter 1. Product Overview

1.1

INTRODUCTION

This chapter provides an overview of the MCP2210 Breakout Module and covers the

following topics:

• MCP2210 Breakout Module General Description

• What the MCP2210 Breakout Module Kit Includes

1.2

MCP2210 BREAKOUT MODULE GENERAL DESCRIPTION

The MCP2210 Breakout Module is a development and evaluation platform for the

MCP2210 device. The module is comprised of a single DIP form-factor board.

The MCP2210 Breakout Module has the following features:

• SPI bus signals (MOSI, MISO, SCK)

• Nine GP lines, configurable for GPIO, Chip Select or dedicated function operation

• Provides a user selectable (by using a jumper) power supply of 3.3V or 5V (up to

500 mA)

• DIP form-factor (0.6 inches overall row spacing between pins)

• PICkit™ Serial Analyzer header – used for SPI communication only

A Windows®-based PC software was created to help with the evaluation/demonstration

of the MCP2210 device as a USB-to-SPI (Master) device. It allows I/O control and

custom device configuration. The software is downloadable from the board web page

on www.microchip.com.

A DLL package is included to allow development of custom PC applications using the

MCP2210. The DLL package is also available for download on the board web page.

1.3

WHAT THE MCP2210 BREAKOUT MODULE KIT INCLUDES

The MCP2210 Breakout Module Kit includes:

• MCP2210 Breakout Module (ADM00419)

•Mini-USB cable

• Important Information Sheet

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