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EMIF06-MSD02C3 Folha de dados(PDF) 9 Page - STMicroelectronics |
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EMIF06-MSD02C3 Folha de dados(HTML) 9 Page - STMicroelectronics |
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9 / 11 page ![]() EMIF06-mSD02C3 Package information Doc ID 16910 Rev 1 9/11 4 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 18. Package dimensions Figure 19. Footprint Figure 20. Marking 1.54 mm ± 40 µm 255 µm ± 40 400 µm ± 40 170 µm ± 10 650 µm ± 60 220 µm recommended 220 µm recommended 260 µm maximum Solder stencil opening: Copper pad Diameter: Solder mask opening: 300 µm minimum x y z w x w Dot, ST logo ECOPACK status xx = marking yww = datecode y = year, ww = week z = manufacturing location |
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