MC7824ACT datasheet(22/34 Pages) ONSEMI

22 / 34 page

MC7800, MC7800A, MC7800AE, NCV7800

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Figure 13. Worst Case Power Dissipation versus

Ambient Temperature (Case 221A)

Figure 14. Input Output Differential as a Function

of Junction Temperature (MC78XXC, AC, B)

8.0

4.0

-50

-25

025

5075

100

125

150

TA, AMBIENT TEMPERATURE (°C)

qHS = 0°C/W

0.5

-75

-50

-25

100

125

TJ, JUNCTION TEMPERATURE (°C)

IO = 0 mA

IO = 20 mA

IO = 1.0 A

IO = 500 mA

IO = 200 mA

DVO = 2% of VO

- - - Extended Curve for MC78XXB

qJC = 5°C/W

qJA = 65°C/W

TJ(max) = 150°C

qHS = 5°C/W

qHS = 15°C/W

No Heatsink

2.0

1.5

1.0

2.5

Figure 15. D2PAK Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

1.0

1.5

2.0

2.5

3.0

3.5

010

5.0

L, LENGTH OF COPPER (mm)

PD(max) for TA = 50°C

Minimum

Size Pad

2.0 oz. Copper

Free Air

Mounted

Vertically

RqJA

100

0.4

0.8

1.2

1.6

2.0

2.4

010

5.0

L, LENGTH OF COPPER (mm)

PD(max) for TA = 50°C

Minimum

Size Pad

Free Air

Mounted

Vertically

RqJA

2.0 oz. Copper

Figure 16. DPAK Thermal Resistance and Maximum

Power Dissipation versus P.C.B. Copper Length

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