TQP7M9101

¼W High Linearity Amplifier

Pin Configuration and Description

RF IN

GND

RF OUT

GND

1

23

4

Pin

Symbol

Description

1

RF IN

RF Input. Requires conjugate match for optimal performance.

2, 4

GND

RF/DC Ground Connection

3

RFout / Vcc

RF Output, matched to 50 ohms. External DC Block and supply voltage is required.

Applications Information

PC Board Layout

1071363AW REV - 1071363PC REV -

GND

SOT89 EVAL. BRD., 1/2 WATT

PCB Material (stackup):

1 oz. Cu top layer

1 oz. Cu MIDDLE layer 1

Core Nelco N-4000-13

1 oz. Cu middle layer 2

0.014 inch Nelco N-4000-13

1 oz. Cu bottom layer

Finished board thickness is 0.062±.006

50 ohm line dimensions: width = .031”, spacing = .035”.

The pad pattern shown has been developed and tested for

optimized assembly at TriQuint Semiconductor. The PCB

land pattern has been developed to accommodate lead and

package tolerances. Since surface mount processes vary

from supplier to supplier, careful process development is

recommended.

Advanced Data Sheet: Rev D 09/19/11

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8 of 8 -

Disclaimer: Subject to change without notice

© 2011 TriQuint Semiconductor, Inc.

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