MPC5643L datasheet(81/136 Pages) FREESCALE

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Electrical characteristics

MPC5643L Microcontroller Data Sheet, Rev. 8.1

Freescale Semiconductor

San Jose, CA 95134 USA

(408) 943-6900

MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or

303-397-7956.

JEDEC specifications are available on the WEB at http://www.jedec.org.

C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine

Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47–54.

G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic

Packaging and Production, pp. 53–58, March 1998.

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application

in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212–220.

3.5

Electromagnetic Interference (EMI) characteristics

The characteristics in Table 14 were measured using:

•

Device configuration, tet conditions, and EM testing per standard IEC61967-2

•

Supply voltage of 3.3 V DC

•

Ambient temperature of 25

C

The configuration information referenced in Table 14 is explained in Table 13.

Table 13. EMI configuration summary

Configuration name

Description

Configuration A

• High emission = all pads have max slew rate, LVDS pads running at 40 MHz

• Oscillator frequency = 40 MHz

• System bus frequency = 80 MHz

• No PLL frequency modulation

• IEC level I (

 36 dBV)

Configuration B

• Reference emission = pads use min, mid and max slew rates, LVDS pads disabled

• Oscillator frequency = 40 MHz

• System bus frequency = 80 MHz

• 2% PLL frequency modulation

• IEC level K(

 30 dBV)

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