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Os motores de busca de Datasheet de Componentes eletrônicos |
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Os motores de busca de Datasheet de Componentes eletrônicos |
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SE1010W Folha de dados(PDF) 7 Page - SiGe Semiconductor, Inc. |
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SE1010W Folha de dados(HTML) 7 Page - SiGe Semiconductor, Inc. |
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7 / 9 page  SE1010W LightCharger TM 622 Mb/s Transimpedance Amplifier Final 41-DST-01 § Rev 1.5 § May 24/02 7 of 9 The diagram below shows the bondpad configuration of the SE1010W Transimpedance Am plifier. Note that the diagram is not to scale. All bondpads are 92 µm x 92 µm with a passivation opening of 82 µm x 82 µm. There are two VCC1 and two VEE1 pads for ease of wire bonding; these pad pairs are connected on-chip and only one pad of each type is required to be bonded out. Mechanical die visual inspection criteria per MIL-STD-883 Method 2010.10 Condition B Class Level B. 998.0 130.0 130.0 130.0 123.0 126.0 307.3 1250.0 All Dimensions in Microns (µm) Top View Side View 300.7 998.0 130.0 130.0 130.0 123.0 126.0 307.3 1250.0 All Dimensions in Microns (µm) 998.0 130.0 130.0 130.0 123.0 126.0 307.3 1250.0 All Dimensions in Microns (µm) 998.0 130.0 130.0 130.0 123.0 126.0 307.3 1250.0 All Dimensions in Microns (µm) Top View Side View 300.7 |
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