ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

6 of 27

www.diodes.com

Suggested Pad Layout

© Diodes Incorporated

U-DFN2020-3

Type B

U-DFN2020-6

Dimensions

Value

(in mm)

C

1.30

G

0.24

X

0.35

X1

1.52

Y

1.09

Y1

0.47

Y2

0.50

Dimensions

Value

(in mm)

Z

1.67

G

0.15

X1

0.90

X2

0.45

Y

0.37

C

0.65

U-DFN2020-6

Type B

U-DFN2020-6

Type E

Dimensions

Value

(in mm)

Z

1.67

G

0.20

G1

0.40

X1

1.0

X2

0.45

Y

0.37

Y1

0.70

C

0.65

Dimensions

Value

(in mm)

C

0.650

X

0.400

X1

0.285

X2

1.050

Y

0.500

Y1

0.920

Y2

1.600

Y3

2.300

U-DFN2510-8

U-DFN2523-6

Dimensions

Value

(in mm)

c

0.5

c1

1.0

G

0.2

X

0.2

X1

0.4

Y

0.6

Y1

1.4

Dimensions Value (in mm)

C

0.650

X

0.400

X1

1.700

Y

0.650

Y1

0.450

Y2

1.830

Y3

2.700

X

Y1

Y

Y2

X1

C

G

G

G

YC

Z

Y

X2

X1

G

G

Y

C

Z

Y1

X2

X1

G1

X1

Y3

X (6x)

C

X2

Y1

Y2

Y (2x)

Y1

X1

c

X

G

c1

Y

X1

Y1

X

Y3

Y2

Y

C