ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

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SOT963

Dimensions

Value (in mm)

C

0.350

X

0.200

Y

0.200

Y1

1.100

SOT89-3

SOT89-5

Dimensions Value (in mm)

X

0.900

X1

1.733

X2

0.416

Y

1.300

Y1

4.600

Y2

1.475

Y3

0.950

Y4

1.125

C

1.500

Dimensions Value (in mm)

X1

1.7

X2

0.55

X3

0.4

Y1

4.6

Y2

1.2

Y3

0.5

Y4

1.1

C

3.0

TO252 (DPAK)

Dimensions

Value (in mm)

Z

11.6

X1

1.5

X2

7.0

Y1

2.5

Y2

7.0

C

6.9

E1

2.3

TO263 (D

Dimensions

Value (in mm)

C

5.08

X

1.10

X1

10.41

Y

3.50

Y1

7.01

Y2

15.99

Y1

Y (6X)

C

C

X (6X)

Y1

X1

Y2

Y

C

X (3x)

Y3

Y4

X2 (2x)

Y1

X3

X1

Y3

Y2

X2

C

Y4

X2

C

Z

X1

Y1

E1

Y2

X1

Y

Y2

C

X

Y1