ADP2325

Data Sheet

Rev. 0 | Page 32 of 32

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

Figure 61. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Output Voltage

Package Description2

Package Option

ADP2325ACPZ-R7

−40°C to +125°C

Adjustable

32-Lead LFCSP_WQ

CP-32-7

ADP2325-EVALZ

Evaluation Board

ADP2325-BL1-EVZ

Blank Dual Output Evaluation Board

ADP2325-BL2-EVZ

Blank Single Output Evaluation Board

1

Z = RoHS Compliant Part.

2

For the blank evaluation boards, users can request an unpopulated board from Analog Devices, Inc., through the ADIsimPower tool found at

www.analog.com/ADIsimPower, as well as generate schematics and a bill of materials from the tool.

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

©2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D10036-0-2/12(0)

www.analog.com/ADP2325