ADP7102ARDZ-5.0-R7 datasheet(24/28 Pages) AD

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ADP7102ARDZ-5.0-R7 Folha de dados(PDF) 24 Page - Analog Devices

24 / 28 page

ADP7102

Data Sheet

Rev. A | Page 24 of 28

PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP7102. However, as listed in Table 6, a point of diminishing

returns is eventually reached, beyond which an increase in the

copper size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0805 or 0603 size capacitors and

resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 79. Example LFCSP PCB Layout

Figure 80. Example SOIC PCB Layout

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