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TBU-PL050-100-WH_1107 Folha de dados(PDF) 1 Page - Bourns Electronic Solutions

Nome de Peças TBU-PL050-100-WH_1107
Descrição Electrónicos  TBU짰 High-Speed Protectors
PDF  7 Pages
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Fabricante Electrônico  BOURNS [Bourns Electronic Solutions]
Página de início  http://www.bourns.com
Logo BOURNS - Bourns Electronic Solutions

TBU-PL050-100-WH_1107 Folha de dados(HTML) 1 Page - Bourns Electronic Solutions

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Features
Superior circuit protection
Overcurrent & overvoltage protection
Blocks surges up to rated limits
High-speed performance
Small SMT package
RoHS compliant*
Agency recognition:
Applications
SLIC protection
Cable & DSL
MDU/MTU modems
ONT
Voice/DSL line cards
TBU-PL Series - TBU® High-Speed Protectors
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
General Information
The TBU-PL Series of Bourns® TBU® products are low capacitance dual bidirectional high-speed
protection components, constructed using MOSFET semiconductor technology, and designed to
protect against faults caused by short circuits, AC power cross, induction and lightning surges.
In addition to overcurrent protection, an added feature is the voltage monitoring on the two lines. If the
voltage on the line drops below Vss then the voltage will trigger the device to switch to the blocking
state.
The TBU® high-speed protector placed in the system circuit will monitor the current with the MOSFET
detection circuit triggering to provide an effective barrier behind which sensitive electronics will not be
exposed to large voltages or currents during surge events. The TBU® device is provided in a surface
mount DFN package and meets industry standard requirements such as RoHS and Pb Free solder
reflow profiles.
Agency Approval
TBU ® Device
Line 1 SLIC
Line 1
Line 2 SLIC
Line 2
Vdd
Vss
Description
UL
File Number: E315805
Industry Standards (in Conjunction with OVP Device)
Absolute Maximum Ratings (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Part Number
Value
Unit
Vimp
Peak impulse voltage withstand with duration less than 10 ms
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
500
600
750
850
V
Vrms
Continuous A.C. RMS voltage
TBU-PL050-xxx-WH
TBU-PL060-xxx-WH
TBU-PL075-xxx-WH
TBU-PL085-xxx-WH
300
350
400
425
V
Top
Operating temperature range
-55 to +125
°C
Tstg
Storage temperature range
-65 to +150
°C
Tjmax
Maximum Junction Temperature
+125
°C
ESD
HBM ESD Protection per IEC 61000-4-2 on line pads
±2
kV
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Symbol
Parameter
Part Number
Min.
Typ.
Max.
Unit
Itrigger
Current required for the device to go from operating state to
protected state
TBU-PLxxx-100-WH
TBU-PLxxx-200-WH
100
200
150
300
200
400
mA
Rdevice
Series resistance of the TBU® device
40
50
55
Ω
Rmatch
Package resistance matching of the TBU® device #1 - TBU® device #2
±0.5
±1.0
Ω
tblock
Time taken for the device to go into current limiting
1
µs
IQ
Current through the triggered TBU® device with 50 Vdc circuit voltage
0.25
0.70
1.50
mA
Iss
Operating current with Vss = -50 V
100
µA
Vreset
Voltage below which the triggered TBU® device will
transition to normal operating state
TBU-PLxxx-100-WH
TBU-PLxxx-200-WH
12
15
15
20
22
25
V
Vto
Voltage threshold offset with 60 Hz applied voltage, with Vss -50 V (Vss - VlineSLIC)
-1.0
0.2
V
Vss
Operating voltage range relative to Vdd
-180
-20
V
Rth(j-l)
One side junction to package pads - FR4 using minimum recommended pad layout
110
°C/W
Rth(j-l)
Both sides junction to package pads - FR4 using minimum recommended pad layout
65
°C/W
Rth(j-l)
One side junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2)
40
°C/W
Rth(j-l)
Both sides junction to package pads - FR4 using heat sink on board (6 cm2) (0.5 in.2)
70
°C/W
L501
C954
Solutions available for GR-1089-CORE, ITU-T and a combination of both.


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