SM15TY datasheet(4/12 Pages) STMICROELECTRONICS

4 / 12 page

Characteristics

SM15TY

4/12

Doc ID 17865 Rev 1

Figure 3.

Peak pulse power dissipation

versus initial junction temperature

(typical values)

Figure 4.

Peak pulse power versus

exponential pulse duration

(Tj initial = 25 °C)

500

1000

1500

2000

100

125

150

175

P (W)

T (°C)

10/1000 µs

0.1

1.0

10.0

100.0

1.0E-03

1.0E-02

1.0E-01

1.0E+00

1.0E+01

P (kW)

tp (ms)

Figure 5.

Clamping voltage versus peak

pulse current (exponential

waveform, maximum values)

Figure 6.

Junction capacitance versus

reverse applied voltage for

unidirectional types (typical values)

0.1

1.0

10.0

100.0

1000.0

100

1000

I (A)

V (V)

Tj initial=25 °C

8/20 µs

10/1000 µs

10 ms

SM15T22AY/CAY

SM15T68AY/CAY

SM15T30AY/CAY

C(nF)

0.10

1.00

10.00

100

F=1 MHz

Vosc=30 mVRMS

Tj=25 °C

SM15T30AY

SM15T68AY

V (V)

Figure 7.

Junction capacitance versus

reverse applied voltage for

bidirectional types (typical values)

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under each lead

C(nF)

0.1

1.0

10.0

100

F=1 MHz

Vosc=30 mVRMS

Tj=25 °C

SM15T30CAY

SM15T68CAY

V (V)

100

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

(°C/W)

th(j-a)

S (cm²)

Printed circuit board FR4,

copper thickness = 35 µm

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