ADP151 datasheet(5/24 Pages) AD

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ADP151

Rev. D | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6.5 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to +6.5V

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Operating Ambient Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under absolute maximum ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP151 can be damaged when the junction

temperature limits are exceeded. Monitoring ambient temperature

does not guarantee that TJ is within the specified temperature

limits. In applications with high power dissipation and poor

thermal resistance, the maximum ambient temperature may

have to be derated.

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA).

The maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using the

formula

TJ = TA + (PD × θJA)

The junction-to-ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent

on the application and board layout. In applications where high

maximum power dissipation exists, close attention to thermal

board design is required. The value of θJA may vary, depending

on PCB material, layout, and environmental conditions. The

specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit

board. See JESD51-7 and JESD51-9 for detailed information

on the board construction. For additional information, see the

AN-617 Application Note, MicroCSP™ Wafer Level Chip Scale

Package, available at www.analog.com.

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information, states

that thermal characterization parameters are not the same as

thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation from

the package, factors that make ΨJB more useful in real-world

applications. Maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD)

using the formula

TJ = TB + (PD × ΨJB)

See JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

ΨJB

Unit

5-Lead TSOT

170

°C/W

4-Ball, 0.4 mm Pitch WLCSP

260

°C/W

6-Lead 2 mm × 2 mm LFCSP

63.6

28.3

°C/W

ESD CAUTION

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