2002 Jan 04

21

NXP Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital

volume control and headphone sensing

TDA8552T; TDA8552TS

PACKAGE OUTLINES

UNIT

A

max.

cD

(1)

E

(1)

(1)

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

inches

2.65

0.3

0.1

2.45

2.25

0.49

0.36

0.32

0.23

13.0

12.6

7.6

7.4

1.27

10.65

10.00

1.1

1.0

0.9

0.4

8

0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.1

0.4

SOT163-1

10

20

detail X

Z

e

11

1

D

y

0.25

075E04

MS-013

pin 1 index

0.1

0.012

0.004

0.096

0.089

0.019

0.014

0.013

0.009

0.51

0.49

0.30

0.29

0.05

1.4

0.055

0.419

0.394

0.043

0.039

0.035

0.016

0.01

0.25

0.01

0.004

0.043

0.016

0.01

0

5

10 mm

scale

X

θ

A

Q

E

c

L

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

99-12-27

03-02-19