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MPXV4006DP Folha de dados(PDF) 21 Page - Freescale Semiconductor, Inc

Nome de Peças MPXV4006DP
Descrição Electrónicos  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  22 Pages
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Fabricante Electrônico  FREESCALE [Freescale Semiconductor, Inc]
Página de início  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPXV4006DP Folha de dados(HTML) 21 Page - Freescale Semiconductor, Inc

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MPXV4006
Sensors
Freescale Semiconductor
21
Pressure
PACKAGE DIMENSIONS
NOTES:
1.
2.
3.
4.
CONTROLLING DIMENSION: INCH.
INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
DIMENSIONS "D" AND "E1" DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM.
N
A
C
0.004 (0.1)
DETAIL G
SEATING
PLANE
8X
P
T
∅
D
E
e/2
e
A
M
0.004 (0.1)
B
C
E1
A
B
A
0.008 (0.20)
B
C
8X
b
2 PLACES 4 TIPS
1
4
8
5
F
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.300
0.330
7.11
7.62
A1
0.002
0.010
0.05
0.25
b
0.038
0.042
0.96
1.07
D
0.465
0.485
11.81
12.32
E
E1
0.465
0.485
11.81
12.32
e
M
0.270
0.290
6.86
7.36
N
0.080
0.090
2.03
2.28
P
0.009
0.011
0.23
0.28
T
0.115
0.125
2.92
3.17
0.100 BSC
2.54 BSC
F
0.245
0.255
6.22
6.47
K
0.120
0.130
3.05
3.30
L
0.061
0.071
1.55
1.80
0˚
7˚
0˚
7˚
θ
0.717 BSC
18.21 BSC
K
M
GAGE
PLANE
DETAIL G
L
A1
θ
.014 (0.35)
CASE 1369-01
ISSUE O
SMALL OUTLINE PACKAGE



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