M48T08, M48T08Y, M48T18

Maximum ratings

Doc ID 2411 Rev 10

19/31

4

Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Table 6.

Absolute maximum ratings

Caution:

Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup

mode.

Caution:

Symbol

Parameter

Value

Unit

Ambient operating temperature

0 to 70

°C

–40 to 85

°C

(1)(2)(3)

1.

For DIP package, soldering temperature of the IC leads is to not exceed 260 °C for 10 seconds. In order to

protect the lithium battery, preheat temperatures must be limited such that the battery temperature does

not exceed +85 °C. Furthermore, the devices shall not be exposed to IR reflow.

2.

For DIP packaged devices, ultrasound vibrations should not be used for post-solder cleaning to avoid

damaging the crystal.

3.

For SO package, lead-free (Pb-free) lead finish: reflow at peak temperature of 260 °C (the time above

255 °C must not exceed 30 seconds).

Lead solder temperature for 10 seconds

260

°C

Input or output voltages

–0.3 to 7

V

Supply voltage

–0.3 to 7

V

Output current

20

mA

Power dissipation

1

W