STM706PDS6F datasheet(22/33 Pages) STMICROELECTRONICS

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Maximum ratings

STM706T/S/R, STM706P, STM708T/S/R

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Doc ID 10518 Rev 10

Maximum ratings

Stressing the device above the rating listed in the “absolute maximum ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Table 4.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

TSTG

Storage temperature (VCC Off)

–55 to 150

°C

TSLD

(1)

Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds

260

°C

VIO

(2)

Negative undershoot of –1.5 V for up to 10 ns or positive overshoot of VCC + 1.5 V for up to 10 ns is

allowable on the WDI and MR input pins.

Input or output voltage

–0.3 to VCC +0.3

VCC

Supply voltage

–0.3 to 7.0

Output current

Power dissipation

320

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