M93C86 datasheet(31/37 Pages) STMICROELECTRONICS

31 / 37 page

M93C86, M93C76, M93C66, M93C56, M93C46

Package mechanical data

Doc ID 4997 Rev 10

31/37

Figure 14.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline

Drawing is not to scale.

The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be

allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering

process.

The circle in the top view of the package indicates the position of pin 1.

Table 26.

UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters

inches(1)

Values in inches are converted from mm and rounded to 4 decimal digits.

Typ

Min

Max

Typ

Min

Max

0.55

0.45

0.6

0.0217

0.0177

0.0236

0.02

0.05

0.0008

0.002

0.25

0.2

0.3

0.0098

0.0079

0.0118

1.9

2.1

0.0787

0.0748

0.0827

D2 (rev MB)

1.6

1.5

1.7

0.063

0.0591

0.0669

D2 (rev MC)

1.45

1.7

0.0571

0.0669

2.9

3.1

0.1181

0.1142

0.122

E2 (rev MB)

0.2

0.1

0.3

0.0079

0.0039

0.0118

E2 (rev MC)

1.25

1.6

0.0492

0.063

0.5

0.0197

0.3

0.0118

0.3

0.5

0.0118

0.0197

0.15

0.0059

0.3

0.0118

ddd(2)

Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.05

0.002

ZW_MEc

ddd

Pin 1

REV MB

REV MC

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