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6402 Folha de dados(PDF) 51 Page - Intel Corporation

Nome de Peças 6402
Descrição Electrónicos  Advanced Memory Buffer
PDF  250 Pages
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Fabricante Electrônico  INTEL [Intel Corporation]
Página de início  http://www.intel.com
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6402 Folha de dados(HTML) 51 Page - Intel Corporation

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Intel® 6400/6402 Advanced Memory Buffer Datasheet
51
Electrical, Power, and Thermal
4.4.12
Reference DDR2 Interface Package Trace Lengths
The following reference package trace lengths have been incorporated into the Advance
Memory Buffer timings in Table 4-9.
4.5
SMBUS Interface
Note:
Based on High-power SMBus DC Specification
4.6
Miscellaneous I/O (1.5 Volt CMOS Driver)
4.7
Thermal Diode and Analog to Digital Converter
(ADC)
A thermal diode with an analog to digital converter (ADC) is required. The thermal
sensor will be used to ensure prevention of catastrophic failure.
Table 4-9.
Advance Memory Buffer DDR2 Package Lengths
Signal Group
Min Length
Max Length
Units
CLK/CLK
24
26
mm
Command/Address
4
20
mm
CKE, CS#
9
22
mm
ODT
10
16
mm
DQS/DQS/DQ
9
13
mm
Table 4-10. Recommended Operating Conditions for SMBUS Interface
Symbol
Parameter
Min
Typ
Max
Unit
Comments
VDDSPD
Supply voltage (SMBUS)
3.0
3.3
3.6
V
3.3v +10%
VIL
SMBus signal input low voltage
-
-
0.8
V
VIH
SMBus signal input high voltage
2.1
-
VDDSPD
V
VOL
SMBus signal output low voltage
-
-
0.4
V
@IPULLUP
ILEAK-BUS
Input Leakage per bus segment
-
-
+200
µA
ILEAK-PIN
Input Leakage per device pin
-
-
+10
µA
IPULLUP
Current sinking, VOL = 0.4V
4
-
-
mA
CBUS
Capacitive load per bus segment
-
-
400
pF
CI
Capacitance for SMBDAT or
SMBCLK pin
--
10
pF
VNOISE
Signal noise immunity from
10MHz to 100MHz
300
-
-
mV p-p
This is AC item applies to
the high-power DC
specification only
Table 4-11. Recommended Operating Conditions for RESET and BFUNC Pins
Symbol
Parameter
Min
Typ
Max
Unit
Comments
VIH(dc)
DC HIGH-level input voltage
1.0
-
-
V
VIL(dc)
DC LOW-level input voltage
-
-
0.5
V
ILEAK
Input leakage
-
-
+ 90
µA



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