MAX16833B datasheet(2/22 Pages) MAXIM

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High-Voltage HB LED Drivers with

Integrated High-Side Current Sense

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

IN to PGND........................................................... -0.3V to +70V

ISENSE+, ISENSE-, DIMOUT to PGND................ -0.3V to +80V

DIMOUT to ISENSE+...............................................-9V to +0.3V

ISENSE- to ISENSE+ ............................................-0.6V to +0.3V

PGND to SGND....................................................-0.3V to +0.3V

VCC to PGND ..........................................................-0.3V to +9V

NDRV to PGND ........................................ -0.3V to (VCC + 0.3V)

OVP, PWMDIM, COMP, LFRAMP, REF, ICTRL,

RT/SYNC, FLT to SGND ...................................-0.3V to +6.0V

CS to PGND .........................................................-0.3V to +6.0V

Continuous Current on IN ................................................100mA

Peak Current on NDRV ........................................................ Q3A

Continuous Current on NDRV ....................................... Q100mA

Short-Circuit Duration on VCC...................................Continuous

Continuous Power Dissipation (TA = +70NC)

16-Pin TSSOP (derate 26.1mW/NC above +70NC) .....2089mW

Junction-to-Case Thermal Resistance (BJC) (Note 1)

16-Pin TSSOP ............................................................. +3NC/W

Junction-to-Ambient Thermal Resistance (BJA) (Note 1)

16-Pin TSSOP ........................................................ +38.3NC/W

Operating Temperature Range ...................... -40NC to +125NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(VIN = 12V, RRT = 12.4kI, CIN = CVCC = 1µF, CLFRAMP/CREF = 0.1µF, NDRV = COMP = DIMOUT = PWMDIM = FLT = unconnected,

VOVP = VCS = VPGND = VSGND = 0V, VISENSE+ = VISENSE- = 45V, VICTRL = 1.40V, TA = TJ = -40NC to +125NC, unless otherwise

noted. Typical values are at TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

SYSTEM SPECIFICATIONS

Operational Supply Voltage

VIN

Supply Current

IINQ

PWMDIM = 0, no switching

1.5

2.5

Switching

2.5

Undervoltage Lockout (UVLO)

UVLORIN

VIN rising

4.2

4.55

4.85

UVLOFIN

VIN falling, IVCC = 35mA

4.05

4.3

4.65

UVLO Hysteresis

250

Startup Delay

tSTART_DELAY During power-up

1024

Clock

Cycles

UVLO Falling Delay

tFALL_DELAY During power-down

3.3

VCC LDO REGULATOR

Regulator Output Voltage

VCC

0.1mA P IVCC P 50mA, 9V P VIN P 14V

6.75

6.95

7.15

14V P VIN P 65V, IVCC = 10mA

Dropout Voltage

VDOVCC

IVCC = 50mA, VIN = 5V

0.15

0.35

Short-Circuit Current

IMAXVCC

VCC = 0V, VIN = 5V

100

150

OSCILLATOR (RT/SYNC)

Switching Frequency Range

fSW

100

1000

kHz

Bias Voltage at RT/SYNC

VRT

Maximum Duty Cycle

DMAX

VCS = 0

87.5

88.5

89.5

Oscillator Frequency Accuracy

-5

Synchronization Logic-High Input

VIH-SYNC

VRT rising

3.8

Synchronization Frequency Range

fSYNCIN

1.1fSW

1.7fSW

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