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SC18IS602B Folha de dados(PDF) 21 Page - NXP Semiconductors |
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SC18IS602B Folha de dados(HTML) 21 Page - NXP Semiconductors |
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21 / 25 page ![]() SC18IS602B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 5 — 3 August 2010 21 of 25 NXP Semiconductors SC18IS602B I2C-bus to SPI bridge For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Abbreviations MSL: Moisture Sensitivity Level Fig 22. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 16. Abbreviations Acronym Description CDM Charged Device Model CPU Central Processing Unit EEPROM Electrically Erasable Programmable Read-Only Memory ESD ElectroStatic Discharge GPIO General Purpose Input/Output HBM Human Body Model I/O Input/Output I2C-bus Inter-Integrated Circuit bus LSB Least Significant Bit MM Machine Model MSB Most Significant Bit SPI Serial Peripheral Interface |
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