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AS1330

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated in Section 6 Electrical

Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may

affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Notes

All Pins to GND

-0.3

5

V

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+125

ºC

Latch-Up

-100

100

mA

@85°C, JEDEC 78

ESD

2kV

HBM MIL-Std. 883E 3015.7 methods

Package Body Temperature

+260

ºC

The reflow peak soldering temperature

(body temperature) specified is in

accordance with IPC/JEDEC J-STD-

020D “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded

packages is matte tin (100% Sn).