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SC16IS752IPW Folha de dados(PDF) 52 Page - NXP Semiconductors

Nome de Peças SC16IS752IPW
Descrição Electrónicos  Dual UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support
PDF  59 Pages
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Fabricante Electrônico  NXP [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo NXP - NXP Semiconductors

SC16IS752IPW Folha de dados(HTML) 52 Page - NXP Semiconductors

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SC16IS752_SC16IS762_7
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 07 — 19 May 2008
52 of 59
NXP Semiconductors
SC16IS752/SC16IS762
Dual UART with I2C-bus/SPI interface, 64-byte FIFOs, IrDA SIR
15. Package outline
Fig 37.
Package outline SOT361-1 (TSSOP28)
UNIT
A1
A2
A3
bp
cD (1)
E (2)
(1)
eHE
LLp
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.8
0.5
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT361-1
MO-153
99-12-27
03-02-19
0.25
w M
b p
Z
e
114
28
15
pin 1 index
θ
A
A1
A2
L p
Q
detail X
L
(A )
3
HE
E
c
v M A
X
A
D
y
0
2.5
5 mm
scale
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
A
max.
1.1



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