ADA4320-1ACPZ-R2 datasheet(6/16 Pages) AD

6 / 16 page

ADA4320-1

Rev. 0 | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

MAXIMUM POWER DISSIPATION

Table 4.

Parameter

Rating

Supply Voltage

5.5 V

Maximum Power Dissipation

1.65 W

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

The maximum safe power dissipation in the ADA4320-1 package

is limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that

the package exerts on the die, permanently shifting the parametric

performance of the ADA4320-1. Exceeding a junction temperature

of 150°C for an extended time can result in changes in the silicon

devices, potentially causing failure.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads

from metal traces, through-holes, ground, and power planes,

reduces the θJA. The exposed paddle on the underside of the

package must be soldered to a pad on the PCB surface that is

thermally connected to a copper plane to achieve the specified θJA.

THERMAL RESISTANCE

θJA is specified for the device soldered to a high thermal

conductivity 4-layer (2s2p) circuit board, as described in

EIA/JESD 51-7.

ESD CAUTION

Table 5. Thermal Resistance

Package Type

θJA

θJC

Unit

24-lead LFCSP

31.2

5.7

°C/W

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