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SG109 Folha de dados(PDF) 2 Page - Microsemi Corporation

Nome de Peças SG109
Descrição Electrónicos  5 -VOLT FIXED VOLTAGE REGULATORS
PDF  3 Pages
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Fabricante Electrônico  MICROSEMI [Microsemi Corporation]
Página de início  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

SG109 Folha de dados(HTML) 2 Page - Microsemi Corporation

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SG109/SG309
4/90 Rev 1.1 2/94
LINFINITY Microelectronics Inc.
Copyright
© 1994
11861 Western Avenue
∞
∞
∞
∞
∞ Garden Grove, CA 92841
2
(714) 898-8121
∞
∞
∞
∞
∞ FAX: (714) 893-2570
Input Voltage ........................................................................ 35V
Power Dissipation ........................................... Internally Limited
Storage Temperature Range ............................. -65
°C to 150°C
ABSOLUTE MAXIMUM RATINGS (Note 1)
Note 1. Exceeding these ratings could cause damage to the device.
K Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
35°C/W
R Package:
Thermal Resistance-Junction to Case,
θ
JC .................
5.0°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
40°C/W
IG Package:
Thermal Resistance-Junction to Case,
θ
JC .................
3.5°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ..............
42°C/W
T Package:
Thermal Resistance-Junction to Case,
θ
JC ..................
15°C/W
Thermal Resistance-Junction to Ambient,
θ
JA ............. 120°C/W
THERMAL DATA
Input Voltage Range ............................................... 7.0V to 25V
Note 2. Range over which the device is functional.
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG109 with -55°C
≤ T
A ≤ 150°C, SG309 with
0°C
≤ T
A ≤
125°C, and for V
IN
= 10V, I
OUT
= 500mA (K, R, and IG -Power Packages-) and I
OUT
= 100mA (T-package). Low duty cycle pulse testing techniques
are used which maintains junction and case temperatures equal to the ambient temperature.)
RECOMMENDED OPERATING CONDITIONS (Note 2)
Units
SG309
SG109
Parameter
Test Conditions
T
A = 25°C
V
IN = 7.1V to 25V, TA = 25°C
T
A = 25°C
Power Pkgs: I
OUT = 5mA to 1.5A
T-package: I
OUT =5mA to 500mA
V
IN= 7.4V to 25V
Power Pkgs: I
OUT = 5mA to 1.0A,
P
≤ 20W
T-package: I
OUT =5mA to 200mA, P ≤ 20W
V
IN = 7.4V to 25V
With Line : V
IN = 7.4V to 25V
With Load: Power Pkgs: I
OUT = 5mA to 1.0A
T-package: I
OUT =5mA to 200mA
f = 10Hz to 100KHz, T
A = 25°C
T
A = 25°C
Output Voltage
Line Regulation
Load Regulation
Total Output Voltage Tolerance
Quiescent Current
Quiescent Current Change
Output Noise Voltage
Long Term Stability
Ripple Rejection
4.7
4.6
4.6
50
5.05
4.0
15
15
5.0
5.0
40
10
5.3
50
100
50
5.4
5.4
10
0.5
0.8
0.8
4.8
4.75
4.75
50
5.05
4.0
15
15
5.00
5.00
40
20
5.2
50
100
50
5.25
5.25
10
0.5
0.8
0.8
V
mV
mV
mV
V
V
mA
mA
mA
mA
µV
mV
dB
Min.
Max.
Typ.
Min.
Typ. Max.
Operating Junction Temperature Range
SG109 ............................................................ -55°C to 150°C
SG309 ............................................................... 0°C to 125°C
Operating Junction Temperature
Hermetic (K, R, T, IG-Packages) .................................. 150
°C
Lead Temperature (Soldering, 10 Seconds) ................ 300
°C
Note A. Junction Temperature Calculation: T
J
= T
A
+ (P
D
x
θ
JA
).
Note B. The above numbers for
θ
JC are maximums for the limiting
thermal resistance of the package in a standard mount-
ing configuration. The
θ
JA numbers are meant to be
guidelines for the thermal performance of the device/
pc-board system. All of the above assume no ambient
airflow.



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