ADP151ACBZ-2.5-R7 datasheet(18/24 Pages) AD

Nome de Peças	ADP151ACBZ-2.5-R7

Descrição Electrónicos	Ultralow Noise,200 mA, CMOS Linear Regulator

PDF	24 Pages

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Fabricante Electrônico	AD [Analog Devices]

Página de início	http://www.analog.com

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ADP151

Rev. 0 | Page 18 of 24

In the case where the board temperature is known, use the

thermal characterization parameter, ΨJB, to estimate the

junction temperature rise (see Figure 49 and Figure 50).

Maximum junction temperature (TJ) is calculated from the

board temperature (TB) and power dissipation (PD) using the

following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 58°C/W for the 4-ball WLCSP package

and 43°C/W for the 5-lead TSOT package.

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 49. WLCSP, TA = 85°C

140

120

100

0.3

4.8

4.3

3.8

3.3

2.8

2.3

1.8

1.3

0.8

VIN – VOUT (V)

ILOAD = 1mA

ILOAD = 10mA

ILOAD = 50mA

ILOAD = 100mA

ILOAD = 150mA

ILOAD = 200mA

MAXIMUM JUNCTION TEMPERATURE

Figure 50. TSOT, TA = 85°C

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