GC9001 – GC9011

Microsemi

Microwave Products

75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748

Page 2

TM

®

Copyright

 2007

Rev: 2009-01-19

RoHS Compliant

PASSIVE DEVICES – Spiral Bias Elements

.

ELECTRICAL PARAMETERS @ 25C

(unless otherwise specified)

Model Number

L(nH)

(Typ)

(Typ)

OUTLINE

GC9005

3

1.0

A

GC9001

6

1.5

A

GC9006

10

2.0

B

GC9002

15

2.5

B

GC9007

21

3.5

C

GC9008

28

4.0

C

GC9003

36

5.0

C

GC9009

45

6.0

D

GC9010

55

7.0

D

GC9011

68

8.0

D

GC9004

78

8.5

D

MECHANICAL DIMENSIONS

OUTLINE

Chip

L(A) X W(B)

(Inches)

(Max)

Chip

Thickness(C)

(Inches)

(+/-0.002)

A

0.031” X 0.031"

0.011

B

0.032” X 0.032"

0.011

C

0.041” X 0.041"

0.011

D

0.061” X 0.061"

0.011

.

RECOMMENDED CHIP ATTACHMENT AND LEAD BONDING PROCEDURES

CHIP ATTACHMENT

Chip attachment to hybrid circuits or module bodies can

be accomplished with either conductive or nonconductive

epoxy paste. EPO TEK H-61 or EPO TEK H-20 are

examples of some commonly used epoxy pastes

RIBBON OR WIRE BONDING

Thermo-compression bonding is recommended. A temperature of

175°C with pressure of 25 grams would be adequate for bonding

most gold ribbon or wire. For optimum performance, attach RF

input to pad at center of coil and the bypass network (capacitance)

to outside pad.