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10

10 - 20

HMC871LC5

v02.0110

EA OPTICAL MODULATOR

DRIVER, DC - 20 GHz

Outline Drawing

NOTES:

1. PACKAGE BODY MATERIAL: ALUMINA

2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHES

GOLD OVER 50 MICROINCHES MINIMUM NICKEL.

3. DIMENSIONS ARE IN INCHES [MILLIMETERS].

4. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

5. PACKAGE WARP SHALL NOT EXCEED 0.05mm DATUM -C-

6. ALL GROUND LEADS AND GROUND PADDLE MUST BE

SOLDERED TO PCB RF GROUND.

Pin Number

Function

Description

Interface Schematic

1, 3, 4, 7 - 12, 14,

16 - 20, 23 - 29, 31

N/C

The pins are not connected internally; however, all data

shown herein was measured with these pins connected

to RF/DC ground externally.

2VC

Output voltage swing adjust. +0.5V should

be applied for nominal operation.

5

RFIN

This pin is DC coupled

and matched to 50 Ohms.

DC blocking is required.

6, 21

GND

These pins and exposed package base

must be connected to RF/DC ground.

13

ACG2

Low frequency termination. Attach bypass

capacitor per application circuit herein.

Pin Descriptions