© 2008 Microchip Technology Inc.

DS22041B-page 31

MCP6031/2/3/4

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

.

Device:

MCP6031:

Single Op Amp

MCP6031T:

Single Op Amp (Tape and Reel)

MCP6032:

Dual Op Amp

MCP6032T:

Dual Op Amp (Tape and Reel)

MCP6033:

Single Op Amp with Chip Select

MCP6033T:

Single Op Amp with Chip Select

(Tape and Reel)

MCP6034:

Quad Op Amp

MCP6034T:

Quad Op Amp (Tape and Reel)

Temperature Range:

E

= -40°C to +125°C

Package:

MC = Plastic Dual Flat, No Lead, (2x3 DFN ) 8-lead **

MS = Plastic MSOP, 8-lead

OT = Plastic Small Outline Transistor, 5-lead *

SL

= Plastic SOIC (150 mil Body), 14-lead

SN = Plastic SOIC, (150 mil Body), 8-lead

ST

= Plastic TSSOP (4.4mm Body), 14-lead

* This package is only available on the MCP6031 device.

** These packages are only available on the MCP6031 and

MCP6033 devices.

PART NO.

X

/XX

Package

Temperature

Range

Device

Examples:

a)

MCP6031-E/SN:

8LD SOIC package.

b)

MCP6031T-E/SN: Tape and Reel,

8LD SOIC package.

c)

MCP6031-E/MS:

8LD MSOP package.

d)

MCP6031T-E/MS: Tape and Reel,

8LD MSOP package.

e)

MCP6031-E/MC:

8LD DFN package.

f)

MCP6031T-E/MC: Tape and Reel,

8LD DFN package.

g)

MCP6031T-E/OT: Tape and Reel,

5-LD SOT-23 package.

a)

MCP6032-E/SN:

8LD SOIC package.

b)

MCP6032T-E/SN: Tape and Reel,

8LD SOIC package.

c)

MCP6032-E/MS:

8LD MSOP package

d)

MCP6032T-E/MS: Tape and Reel

8LD MSOP package.

a)

MCP6033-E/SN:

8LD SOIC package.

b)

MCP6033T-E/SN: Tape and Reel,

8LD SOIC package.

c)

MCP6033-E/MS:

8LD MSOP package.

d)

MCP6033T-E/MS: Tape and Reel,

8LD MSOP package.

e)

MCP6033-E/MC:

8LD DFN package.

f)

MCP6033T-E/MC: Tape and Reel,

8LD DFN package.

a)

MCP6034-E/SL:

14LD SOIC package.

b)

MCP6034T-E/SL: Tape and Reel,

14LD SOIC package.

c)

MCP6034-E/ST:

14LD TSSOP package.

d)

MCP6034T-E/ST: Tape and Reel,

14LD TSSOP package.