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LSRFVY2092-R1-PF Folha de dados(PDF) 7 Page - LIGITEK electronics co., ltd.

Nome de Peças LSRFVY2092-R1-PF
Descrição Electrónicos  DUAL COLOR LED LAMPS
PDF  7 Pages
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Fabricante Electrônico  LIGITEK [LIGITEK electronics co., ltd.]
Página de início  http://www.ligitek.com
Logo LIGITEK - LIGITEK electronics co., ltd.

LSRFVY2092-R1-PF Folha de dados(HTML) 7 Page - LIGITEK electronics co., ltd.

  LSRFVY2092-R1-PF Datasheet HTML 1Page - LIGITEK electronics co., ltd. LSRFVY2092-R1-PF Datasheet HTML 2Page - LIGITEK electronics co., ltd. LSRFVY2092-R1-PF Datasheet HTML 3Page - LIGITEK electronics co., ltd. LSRFVY2092-R1-PF Datasheet HTML 4Page - LIGITEK electronics co., ltd. LSRFVY2092-R1-PF Datasheet HTML 5Page - LIGITEK electronics co., ltd. LSRFVY2092-R1-PF Datasheet HTML 6Page - LIGITEK electronics co., ltd. LSRFVY2092-R1-PF Datasheet HTML 7Page - LIGITEK electronics co., ltd.  
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LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Reliability Test:
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
JIS C 7021: B-12
MIL-STD-883:1008
JIS C 7021: B-10
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
Operating Life Test
1.Ta=-40
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
Low Temperature
Storage Test
1.Ta=105
℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
High Temperature
Storage Test
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Test Condition
Test Item
Description
Reference
Standard
MIL-STD-202:103B
JIS C 7021: B-11
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
1.Ta=65
℃±5℃
2.RH=90 %~95%
3.t=240hrs
±2hrs
1.Ta=105
℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
Thermal Shock Test
High Temperature
High Humidity Test
1.T.Sol=260
℃±5℃
2.Dwell time= 10
±1sec.
Solder Resistance
Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
1.T.Sol=230
℃±5℃
2.Dwell time=5
±1sec
Solderability Test
This test intended to see soldering well
performed or not.
PART NO. LSRFVY2092/R1-PF



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